2023 The International Conference on Materials Science and Mechatronics (ICMSM 2023) will be held in Chongqing, China on July 25, 2023. The conference will serve as an international forum to present and exchange technological advances and research results in the field of materials science and mechatronics. The conference will bring together leading researchers, engineers and scientists in related fields from around the world. We warmly welcome you to submit your research papers to ICMSM 2023 and share your latest research findings and valuable experiences with leading scientists, engineers and scholars from around the world.
Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference.
Please send us your CV by email (firstname.lastname@example.org) if you are interested in it.
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to email@example.com
The normal size of research papers is 3,000+ words excluding abstract and references.
- Submission Deadline: June 20, 2023
- Registration Deadline: June 30, 2023
- Conference Date: July 25,2023
- Notification Date: About a week after the submission
Mail Address: firstname.lastname@example.org
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists: